- Place of Origin:
Guangdong, China (Mainland)
- Brand Name:
- Model Number:
- Base Material:
FR-4, High Tg FR-4, High Frequency board (Rogers, Arlon, Taconic, Nel
- Copper Thickness:
- Board Thickness:
- Min. Hole Size:
- Min. Line Width:
- Min. Line Spacing:
- Surface Finishing:
HASL, Immersion Gold, ENIG,ENEPIG, Immersion Silver, Immersion Tin, Fl
1 to 32 layer
- Special Technique:
Blind &buried via+Impedance
- Board thickness:
0.21mm – 7.0mm
- Solder mask:
- Profiling Punching:
- Frequency of stencil cleaning:
1 time/5 to 10 pieces
- Max Aspect Ratio:
- Max. board size:
- Max panel size:
- 300000 Piece/Pieces per Month
- Packaging Details
- bubble and anti-static bags,Blister bag, PE bag(As per customer’s requirements)
- Delivery Time
- 30 days
- Shenzhen / HK port
- Lead Time
- 30 days
- PCB & PCBA OEM/ODM and clone service
- Sign NDA (Non-disclosure Agreement) for All customers
- MOQ1PCS is available for us
- One-stop turnkey solution
- One Year Product Warranty
- Products are 100% quality checked in both functionality and cosmetic.
PCBA design /assembly /manufacturing company with good service
Fumax is an Electronic Contract Manufacturing company which offers complete solutions for materials sourcing & procurement, PCBA (Printed Circuit Board Assembly), box building (plastic or metal enclosure), manufacturing and order shipment etc.
Based on Shenzhen China, specialized in high Quality, low-to-high volume building, with quick response for New Product Introduction (NPI) and diverse products experience, Fumax serves as a reliable & flexible manufacturing partner to customers worldwide and significantly optimizes our customers’ operations and time to market.
|Detailed Specification of PCB Manufacturing Capacity:|
|PCB Layer||1-32 Layer||Molding board thickness||0.6-3.00mm|
|Min trace width||0.1mm||Min solder mask dam||0.1mm|
|Min space width||0.1mm||Min solder mask clearance||0.03mm|
|Min trace to pad||0.1mm||Min solder mask thickness||0.01mm|
|Min drill diameter||0.2mm||Min Hole Size||0.2mm|
|Min via pad||0.6mm||Min silk legend width||0.1mm|
|Max board size||560mmX720mm||Min silk legend height||0.6mm|
|Surface processing type||
HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/
OSP processing/immersion Tin (Sn)
|Solder mask type||
Green/yellow/black/red/white/blue or transparent photosensitive solder mask
and peel off the blue glue.
High TG board, high frequency board(ROGERS,TEFLON)
halogen-free board (FR-4,CEM-1,CEM-3)
|Electricity performance testing||100% electrical performance testing, high pressure testing|
|Data file format||
Data file format GERBER file and corresponding drilling file, PROTEL series,
|Other testing request||Impendence testing, Hole resistance testing, gold slice up, Solder ability.|
|PCB Assembly SMT & DIP manufacturing Capabilities:|
|Max. PCB Size||410mm x 600mm||Min. PCB Thickness||0.35mm|
|Maximum BGA Size||74 mmx 74mm||BGA Ball Pitch||1mm ~ 3mm|
|QFP Lead Pitch||0.38mm ~ 2.54mm||Min. IC Pitch||0.30mm|
|Min. Chip Placement||1005|
|Type of Assembly||SMT, Thru-hole, Cable assembly, Wire Harness|
|Foot Pin||SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA|
|Solder Type||Water Soluble Solder, Lead-Free, Wave soldering|
|Components||Passive Down to 0201 size|
|BGA and VFBGA|
|Leadless Chip Carriers/CSP/QFN|
|Double-sided SMT Assembly|
|Fine Pitch to 0.8mils|
|BGA Repair and Reball|
|Part Removal and Replacement|
|Component packaging||Cut Tape, Tube ,Reels, Loose Parts|
|Programing||Hex file or bin file firmware.|
|Testing||Flying Probe Test, X-ray Inspection AOI Test|
|Package||Anti-static Bubble Bag & Carton|
|PCB assembly process||
IQC for incoming materials checking—-Material baking
—-SMT—– Semi-Products Testing & QC
—DIP parts — IPQC— Wave Soldering–Semi-Products Testing & QC
—–Assembling-—ICT or Xray—–100% Function Testing
—–Reliability Testing (burn-testing) – Package – Shipping
PCB PCBA Product Images:
Q: What service we can offer?
- A: We offer PCB&PCBA OEM/ODM and clone service to our customers. For PCB clone service, the customer needs to send us the printed circuit board.
Q: What you need to provide for OEM order?
- A: You need to provide Gerber file and BOM list; Testing Method; Software if need programming.
Q: What you need to provide for ODM order?
- A: You need to provide the detail function requirements of the project; Board size /layers requirement.
Q: Where we source the components?
- A: Unless specified, all components are quoted with original customer spec/manufacturer, not substitutes.
Q: How to contact us?
- A: Send your inquiry details in the below. Click “Send” Now!