Pcb Prototype, PCBA OEM/ ODM/ clone/ reverse engineering service, Pcb one stop shop Service

Place of Origin:
Guangdong, China (Mainland)
Brand Name:
Model Number:
Base Material:
FR-4, High Tg FR-4, High Frequency board (Rogers, Arlon, Taconic, Nel
Copper Thickness:
Min 2mil
Board Thickness:
Min. Hole Size:
8 mil
Min. Line Width:
Min. Line Spacing:
Surface Finishing:
HASL, Immersion Gold, ENIG,ENEPIG, Immersion Silver, Immersion Tin, Fl
1 to 32 layer
Special Technique:
Blind &buried via+Impedance
Board thickness:
0.21mm – 7.0mm
Solder mask:
Profiling Punching:
Frequency of stencil cleaning:
1 time/5 to 10 pieces
Max Aspect Ratio:
Max. board size:
Max panel size:
20*24 inch
300000 Piece/Pieces per Month
Packaging Details
bubble and anti-static bags,Blister bag, PE bag(As per customer’s requirements)
Delivery Time
30 days
Shenzhen / HK port
Lead Time
30 days
Our Services
  • PCB & PCBA OEM/ODM and clone service
  • Sign NDA (Non-disclosure Agreement) for All customers
  • MOQ1PCS is available for us
  • One-stop turnkey solution
  • One Year Product Warranty
  • Products are 100% quality checked in both functionality and cosmetic.

PCBA design /assembly /manufacturing company with good service

Company Information

Fumax is an Electronic Contract Manufacturing company which offers complete solutions for materials sourcing & procurement, PCBA (Printed Circuit Board Assembly), box building (plastic or metal enclosure), manufacturing and order shipment etc.

Based on Shenzhen China, specialized in high Quality, low-to-high volume building, with quick response for New Product Introduction (NPI) and diverse products experience, Fumax serves as a reliable & flexible manufacturing partner to customers worldwide and significantly optimizes our customers’ operations and time to market.

Factory view: 



Product Description
Detailed Specification of PCB Manufacturing Capacity:
PCB Layer 1-32 Layer Molding board thickness 0.6-3.00mm
Min trace width 0.1mm Min solder mask dam 0.1mm
Min space width 0.1mm Min solder mask clearance 0.03mm
Min trace to pad 0.1mm Min solder mask thickness 0.01mm
Min drill diameter 0.2mm Min Hole Size 0.2mm
Min via pad 0.6mm Min silk legend width 0.1mm
Max board size 560mmX720mm Min silk legend height 0.6mm
Surface processing type

HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/

OSP processing/immersion Tin (Sn)

Solder mask type

Green/yellow/black/red/white/blue or transparent photosensitive solder mask 

and peel off the blue glue.

Board Material

High TG board, high frequency board(ROGERS,TEFLON) 

halogen-free board (FR-4,CEM-1,CEM-3)

Electricity performance testing 100% electrical performance testing, high pressure testing
Data file format

Data file format GERBER file and corresponding drilling file, PROTEL series,

PADS2000,POWERPCB series,ODB++

Other testing request Impendence testing, Hole resistance testing, gold slice up, Solder ability.
PCB Assembly SMT & DIP manufacturing Capabilities:
Max. PCB Size 410mm x 600mm Min. PCB Thickness 0.35mm
Maximum BGA Size 74 mmx 74mm BGA Ball Pitch 1mm ~ 3mm
QFP Lead Pitch 0.38mm ~ 2.54mm Min. IC Pitch 0.30mm
Min. Chip Placement 1005
Type of Assembly SMT, Thru-hole, Cable assembly, Wire Harness
Solder Type Water Soluble Solder, Lead-Free, Wave soldering
Components Passive Down to 0201 size
Leadless Chip Carriers/CSP/QFN
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packaging Cut Tape, Tube ,Reels, Loose Parts
Programing Hex file or bin file firmware. 
Testing Flying Probe Test, X-ray Inspection AOI Test
Package Anti-static Bubble Bag & Carton
PCB assembly process

IQC for incoming materials checking—-Material baking

—-SMT—– Semi-Products Testing & QC

 —DIP parts — IPQC— Wave Soldering–Semi-Products Testing & QC

—–Assembling-—ICT or Xray—–100% Function Testing

—–Reliability Testing (burn-testing) – Package – Shipping

PCB PCBA Product Images:



Q: What service we can offer?

  • A: We offer PCB&PCBA OEM/ODM and clone service to our customers. For PCB clone service, the customer needs to send us the printed circuit board.

Q: What you need to provide for OEM order?

  • A: You need to provide Gerber file and BOM list; Testing Method; Software if need programming.  

Q: What you need to provide for ODM order?

  • A: You need to provide the detail function requirements of the project; Board size /layers requirement. 

Q: Where we source the components?

  • A: Unless specified, all components are quoted with original customer spec/manufacturer, not substitutes.

Q: How to contact us?

  • A: Send your inquiry details in the below. Click “Send” Now!





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