More and more EMS and CMS companies ask their PCB vendors to provide turn-key solutions for small and medium cases. Based on long-term experience in PCB industry and excellent resource of customers, PCBSourcing starts running turn-key solution to our customers, including boards, components, assembly and e-test service since 2008.
HDI Capability List
Conventional PCB Capability List
PCB Assembly Equipment and Capability
Item Mass production Prototype
Layer Any layer Any layer
Base material FR-4,Halogen free, RCC, Ultra Thin Core/PWB
Surface treatment ENIG+OSP, ENIG, Carbon+OSP, Immersion Tin, OSP
Min. line width/gap 2.5/2.5mil 2.0mil
Critical line width/ tolerance 2.5mil/±15% 2.0mil/±10%
Min. microvia drill size (laser) 3mil 3mil
Min. capture/tagert pad size 10mil 8mil
Min. PTH and buried drill bit 0.2mm 0.2mm
Min. annular ring 3.5mil 3mil
Max. PTH aspect ratio 10:1 12:1
Max. mircovia aspect ratio 0.8:1 0.8:1
Impedance control ±10% ±7%
Solder mask clearance 1.5mil 1mil
Solder mask web 2.5mil 2mil
Min. BGA/CSP pitch 0.4mm 0.4mm
Registration from layer to layer 2mil 2mil
Min.dielectric thickness 2mil 1.8mil
Max. board thickness 1.8mm 2.0mm
PTH hole tolerance ±3mil ±2mil
Min. outline tolerance ±0.1mm ±0.1mm
Min.core thickness 3mil 3mil
Hole structure Stagger via, Stacked via,Skip via, Stepped via, ELIC
Other technology Carbon Jumper,LDI,DLD, Copper filled via, VOP
Item Standard Advanced
Rigid PCB: 2-14  layer 2 – 16 layer
Maximum board size 520×600mm 570×760mm
2 Layer (PTH)  0.4mm – 3.2mm  0.3mm – 3.2mm
Minimum line width 3mil 3mil
Minimum line gap 3.5mil 3.5mil
Outer layer copper thickness base copper:  3 oz                   base copper: 5 oz
Inner layer copper thickness 3 oz(max) 3 oz(max)
Min hole size (mechanical) 0.2mm 0.15mm
Min hole size (laser hole) 0.10mm 0.10mm
Aspect ratio 8:1 0.10mm
Solder mask types and brand: PSR2000,PSR4000 etc PSR2000,PSR4000 etc
Solder mask colour red, black, white, yellow, blue, green red, black, white, yellow, blue, green
Impedance control tolerance ±10% ±7%
Surface treatment Immersion Ag Immersion Ag
Immersion Gold Immersion Gold
HASL HASL, OSP + Immersion Gold
HASL Lead Free HASL Lead Free
Immersion Tin Immersion Tin
Flash Gold Flash Gold
CNC V-cut, degree:  30,45,60  30,45,60
V-cut by hand, degree:  30,45,60  30,45,60
Outline profile Punching, CNC, V-cut Punching, CNC, V-cut
Angle type of chamfer 10-90 10-90
Min. size plugged 0.25mm 0.25mm
Max. size plugged 0.50mm 0.65mm
Min. annular ring can be kept 0.15mm 0.13mm
Min. SM bridge for green SM 0.10mm 0.075mm
PP between each layer 3 3
Tolerance of dimension size ±0.13mm ±0.10mm
Tolerance of board thickness ±10% ±8%
Tolerance of the NPTH ±0.05mm ±0.05mm
Tolerance of the PTH ±0.075mm ±0.075mm
Adiscription Equipment Factory/Model Number Mini Size Output
No.1Factory SMT Machines Juki/KE 2010,2020,2060R 10 Sets 0201 0.4pitchQFP connectoruBGA 3,000,000chips/22H
Full Automatic Printer Minami/mk-878SVMARK 2 Sets 0.4pitch201
IR Reflow Machine HEELER/1809ESL 2 Sets
AdiscriptionNo.2Factory Equipment Factory/Model Number Mini Size Output
SMT Machines Juki/KE2010,2020,2050,FX-1R 13 Sets 0201 0.4pitchQFP connectoruBGA
Full Automatic Printer Minami/mk-878SVMARK 2 Sets 0.4pitch201
Half Automati Printer SAKI 4 Sets
IR Reflow Machine NOUSSTRA/FlOUNG NW850 5 Sets
No.3Factory SMT Machines Juki/KE730,740 12 Sets 4020.4pitch 2,000,000chips/22H
Half Automati Printer SP-3040B 5 Sets
IR Reflow Machine NOUSSTRA/FlOUNG NW850 2 Sets
Our high-accuracy medium speed mounting machine-JUKEKE2050, has increased our surface mount capacity to approximately 2,000,000 points each day, as well as increasing our capabilities in terms of minimum package sizes (down to 0402) and fine pitch (down to 0.30mm) devices QFP, COB and BGA, etc.